Product Description
High-power semiconductor refrigeration sheet TEC1-12715
| Chip type: | TEC1-12715 |
| Size: | 40*40*3.2mm±0.2 Component log:127 |
| wire: | Tin plating on 200±8mm RV standard conductor with 5 mm lead length |
| Internal resistance: | 0.8~0.9Ω(ambient temperature 23±1℃, 1kHZ Ac test) |
| TD MAX: | above 62℃ |
| Working current: | Imax=11.8A (Maximum voltage 15.5V 15A at start-up) |
| Rated voltage: | DC12V(Vmax:15.5V) |
| Refrigeration power: | 142W (excessive heat dissipation surface temperature will reduce cooling power) |
| Assembly pressure: | 85N/cm2 |
| Working environment: | Temperature range-55℃~83℃(excessive ambient temperature drop directly affects refrigeration efficiency) |
| Packaging process: | Surrounding Standard 704 Silicone Rubber Seal |
| Packaging standards: | Foam box packaging, storage conditions, ambient temperature-10℃~40℃ |
| Storage conditions: | -40~60℃ |
| Power requirements: | Single voltage 12V, current 15A or more working power supply (can be used in series and parallel) |
| Device characteristics: | Red wire positive, black wire negative (with literal for refrigeration surface, no literal for heat dissipation surface) |
About us
Exhibition
Advantages
FAQ
